DocumentCode :
1884849
Title :
Comparison of thermal-hydraulic performance of singe-phase micro-pin-fin and micro-channel heat sinks
Author :
Qu, Weilin
Author_Institution :
Dept. of Mech. Eng., Univ. of Hawaii at Manoa, Honolulu, HI
fYear :
2008
fDate :
28-31 May 2008
Firstpage :
105
Lastpage :
112
Abstract :
This study compared thermal-hydraulic performance of a single-phase micro-pin-fin heat sink with that of a micro-channel heat sink having the same characteristic dimensions and operating under the same conditions. The objective was to explore the potential of micro-pin-fin heat sinks as an effective alternative to micro-channel heat sinks for dissipating high-heat-fluxes from small areas. The micro-pin-fin heat sink performance, represented by average convection thermal resistance and pressure loss, was determined experimentally. A micro-pin-fin heat sink was fabricated from 110 copper, and contained an array of 1950 staggered square micro-pin-fins with a 200times200 cross-section and a 670 mum height. Deionized water was employed as the cooling liquid. Coolant inlet temperatures of 30degC and 60degC, and six mass flow rates for each inlet temperature, ranging from 36.7 to 84.5 g/min, were tested. The micro-channel heat sink performance was determined using analytical models. A comparison of the performance showed that the micro-pin-fin heat sink had a lower convection thermal resistance at high cooling liquid flow rates, though it is accompanied by a higher pressure loss.
Keywords :
convection; copper; heat sinks; microchannel flow; cooling liquid; copper; deionized water; high-heat-fluxes; microchannel heat sinks; pressure loss; singe-phase micropin-fin heat sinks; temperature 30 degC; temperature 60 degC; thermal resistance; thermal-hydraulic performance; Analytical models; Coolants; Cooling; Copper; Heat sinks; Performance loss; Resistance heating; Temperature distribution; Testing; Thermal resistance; micro-channel heat sinks; micro-pin-fin heat sinks; pressure loss; single-phase; thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2008.4544260
Filename :
4544260
Link To Document :
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