DocumentCode :
1884882
Title :
Single-phase and two-phase hybrid cooling schemes for high-heat-flux thermal management of defense electronics
Author :
Sung, Myung Ki ; Mudawar, Issam
Author_Institution :
Boiling & Two-Phase Flow Lab. (BTPFL), Purdue Univ. Int. Electron. Cooling Alliance (PUIECA), West Lafayette, IN
fYear :
2008
fDate :
28-31 May 2008
Firstpage :
121
Lastpage :
131
Abstract :
This study examines the cooling performance of two hybrid cooling schemes that capitalize upon the merits of both micro-channel flow and jet impingement to achieve the high cooling fluxes and uniform temperatures demanded by advanced defense electronics. The jets supply HFE 7100 liquid coolant gradually into each micro-channel. The cooling performances of two different jet configurations, a series of circular jets and a single slot jet, are examined both numerically and experimentally. The single-phase performances of both configurations are accurately predicted using 3D numerical simulation. Numerical results point to complex interactions between the jets and the micro-channel flow, and superior cooling performance is achieved by optimal selection of micro-channel height. The two-phase cooling performance of the circular jet configuration is found superior to that of the slot jet, especially in terms of high-flux heat dissipation. Unprecedented cooling fluxes as high as 1,127 W/cm2 are achieved with the circular jets without incurring CHF.
Keywords :
cooling; jets; microchannel flow; thermal management (packaging); circular jets; defense electronics; high-flux heat dissipation; high-heat-flux thermal management; jet configurations; jet impingement; microchannel flow; single slot jet; single-phase cooling schemes; two-phase hybrid cooling schemes; unprecedented cooling fluxes; Coolants; Copper; Electronic equipment testing; Electronics cooling; Heat sinks; Heat transfer; Temperature; Thermal management; Thermal management of electronics; Tin; electronics cooling; high heat flux; jet impingement; micro-channel;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2008.4544262
Filename :
4544262
Link To Document :
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