• DocumentCode
    1884908
  • Title

    Low-temperature two-phase micro-channel cooling for high-heat-flux thermal management of defense electronics

  • Author

    Lee, Jaeseon ; Mudawar, Issam

  • Author_Institution
    Boiling & Two-Phase Flow Lab. (BTPFL), Purdue Univ. Int. Electron. Cooling Alliance (PUIECA), West Lafayette, IN
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    132
  • Lastpage
    144
  • Abstract
    For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm2 in the near future. Direct and indirect low temperature refrigeration cooling facilitate appreciable reduction in the temperature of both coolant and device. This study explores the benefits of cooling the device using direct and indirect refrigeration cooling systems. In the direct cooling system, a micro-channel heat sink serves as an evaporator in a conventional vapor compression cycle using R134a as working fluid. In the indirect cooling system, HFE 7100 is used to cool the heat sink in a primary pumped liquid loop that rejects heat to a secondary refrigeration loop. Two drastically different flow behaviors are observed in these systems. Because of compressor performance constraints, mostly high void fraction two-phase patterns are encountered in the R134a system, dominated by saturated boiling. On the other hand, the indirect refrigeration cooling system facilitates highly subcooled boiling inside the heat sink. Both systems are shown to provide important cooling benefits, but the indirect cooling system is far more effective at dissipating high heat fluxes. Tests with this system yielded cooling heat fluxes as high as 840 W/cm2 without incurring critical heat flux (CHF). Results from both systems are combined to construct an overall map of performance trends relative to mass velocity, subcooling, pressure, and surface tension. Extreme conditions of near-saturated flow, low mass velocity, and low pressure produce ´micro´ behavior, where macro-channel flow pattern maps simply fail to apply, instabilities are prominent, and CHF is quite low. One the other hand, systems with high mass velocity, high subcooling, and high pressure are far more stable and yield- very high CHF values; two-phase flow in these systems follows the fluid flow and heat transfer behavior as well as the flow pattern maps of macro-channels.
  • Keywords
    cooling; heat sinks; microchannel flow; military equipment; thermal management (packaging); two-phase flow; critical heat flux; defense electronics; device heat flux; electronic device; flow pattern map; fluid flow; heat dissipation; heat sink thermal resistance; heat transfer behavior; high-heat-flux thermal management; microchannel cooling; microchannel heat sink; refrigeration cooling system; temperature refrigeration cooling; Coolants; Electronics cooling; Heat pumps; Heat sinks; Refrigeration; Resistance heating; Temperature; Thermal management; Thermal management of electronics; Thermal resistance; high flux; micro-channel; refrigeration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544263
  • Filename
    4544263