DocumentCode
1885067
Title
An investigation of flow boiling regimes in microchannels of different sizes by means of high-speed visualization
Author
Harirchian, Tannaz ; Garimella, Suresh V.
Author_Institution
Sch. of Mech. Eng. & Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN
fYear
2008
fDate
28-31 May 2008
Firstpage
197
Lastpage
206
Abstract
Boiling in microchannel heat sinks is attractive for high-performance electronics cooling due to the high heat transfer rates that can be achieved. However, the physics of flow boiling in microchannels, the flow patterns present, and the effect of microchannel size on the boiling regimes have not been investigated extensively, particularly with dielectric fluids. In the present work, experiments are conducted with a perfluorinated dielectric fluid, Fluorinert FC-77, to investigate the effect of channel size and mass flux (250 to 1600 kg/m2s) on microchannel flow boiling regimes by means of high-speed photography. Seven different silicon test pieces with parallel microchannels of widths ranging from 100 to 5850 mum, all with a depth of 400 mum, are considered. Flow visualizations are performed with a high-speed digital video camera while local measurements of the heat transfer coefficient and pressure drop are simultaneously obtained. The visualizations show that flow regimes in microchannels of width 400 mum and larger are similar, while those in the 100 mum wide microchannels are distinctly different. Also, unlike the 100 mum wide microchannels, in which bubble nucleation at the walls is suppressed at a relatively low heat flux, nucleate boiling is dominant over a wide range of heat flux for microchannels of width 400 mum and larger.
Keywords
boiling; flow visualisation; heat sinks; heat transfer; microchannel flow; thermal management (packaging); Fluorinert FC-77; bubble nucleation; electronics cooling; flow visualization; heat transfer coefficient; microchannel flow boiling; microchannel heat sink; nucleate boiling; perfluorinated dielectric fluid; pressure drop; size 100 mum to 5850 mum; Dielectrics; Electronics cooling; Heat sinks; Heat transfer; Microchannel; Photography; Physics; Silicon; Testing; Visualization; dielectric liquid; local heat transfer; mass flux effect; silicon microchannels; size effect; two-phase flow;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Print_ISBN
978-1-4244-1700-1
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2008.4544271
Filename
4544271
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