Technical review of characterization methods for thermal interface Materials (TIM)

Author

Goel, Nitin ; Anoop, T.K. ; Bhattacharya, A. ; Cervantes, Joseph A. ; Mongia, Rajiv K. ; Machiroutu, Sridhar V. ; Lin, Hau-Lan ; Huang, Ya-Chi ; Fan, Kuang-Cheng ; Denq, Bar-Long ; Liu, Chen-Hua ; Lin, Chun-Hung ; Tien, Chi-Wei ; Pan, Jenq-Haur

Author_Institution

Intel Technol. India Pvt. Ltd., Bengaluru

fYear

2008

fDate

28-31 May 2008

Firstpage

248

Lastpage

258

Abstract

There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering TIM degradation in mobile applications. Various TIM characterization approaches prevalent in industry are discussed in this paper. There is also wide disparity in testing methodologies used across industry to evaluate its performance maps with usage. A set of characterization techniques for better TIM evaluation practices are suggested.

Keywords

automatic test equipment; materials testing; reliability; thermal insulating materials; thermal management (packaging); thermal stresses; ASTM D5470 tester; characterization methods; mobile applications; reliability; thermal interface materials; thermal test vehicles; Conducting materials; Contact resistance; Rough surfaces; Surface resistance; Surface roughness; Testing; Thermal conductivity; Thermal degradation; Thermal management; Thermal resistance; ASTM D5470; TIM; Thermal interface material; characterization methods; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Print_ISBN

978-1-4244-1700-1

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2008.4544277

Filename

4544277