DocumentCode :
1885260
Title :
Technical review of characterization methods for thermal interface Materials (TIM)
Author :
Goel, Nitin ; Anoop, T.K. ; Bhattacharya, A. ; Cervantes, Joseph A. ; Mongia, Rajiv K. ; Machiroutu, Sridhar V. ; Lin, Hau-Lan ; Huang, Ya-Chi ; Fan, Kuang-Cheng ; Denq, Bar-Long ; Liu, Chen-Hua ; Lin, Chun-Hung ; Tien, Chi-Wei ; Pan, Jenq-Haur
Author_Institution :
Intel Technol. India Pvt. Ltd., Bengaluru
fYear :
2008
fDate :
28-31 May 2008
Firstpage :
248
Lastpage :
258
Abstract :
There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering TIM degradation in mobile applications. Various TIM characterization approaches prevalent in industry are discussed in this paper. There is also wide disparity in testing methodologies used across industry to evaluate its performance maps with usage. A set of characterization techniques for better TIM evaluation practices are suggested.
Keywords :
automatic test equipment; materials testing; reliability; thermal insulating materials; thermal management (packaging); thermal stresses; ASTM D5470 tester; characterization methods; mobile applications; reliability; thermal interface materials; thermal test vehicles; Conducting materials; Contact resistance; Rough surfaces; Surface resistance; Surface roughness; Testing; Thermal conductivity; Thermal degradation; Thermal management; Thermal resistance; ASTM D5470; TIM; Thermal interface material; characterization methods; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2008.4544277
Filename :
4544277
Link To Document :
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