• DocumentCode
    1885324
  • Title

    Application of two-phase spray cooling for thermal management of electronic devices

  • Author

    Visaria, Milan ; Mudawar, Issam

  • Author_Institution
    Boiling & Two-Phase Flow Lab. (BTPFL), Purdue Univ. Int. Electron. Cooling Alliance (PUIECA), West Lafayette, IN
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    275
  • Lastpage
    283
  • Abstract
    Recent studies provide ample evidence of the effectiveness of two-phase spray cooling at dissipating large heat fluxes from electronic devices. However, those same studies point to the difficulty predicting spray performance, given the large number of parameters that influence spray behavior. This paper provides a complete set of models/correlations that are required for designing an optimum spray cooling system. Several coolants (water, FC-72, FC-77, FC-87 and PF-5052) are used to generate a comprehensive spray-cooling database for different nozzles, flow rates, subcoolings, and orientations. High-speed video motion analysis is used to enhance the understanding of droplet formation and impact on the device´s surface, especially near the critical heat flux (CHF) point. A previous CHF correlation for normal sprays is modified for both inclination and subcooling effects. A new user-friendly CHF correlation is recommended which shows excellent predictive capability for the entire database. Also discussed in this paper is a new theoretical scheme for assessing the influence of spray overlap on cooling performance.
  • Keywords
    cooling; sprays; thermal management (packaging); FC-72; FC-77; FC-87; PF-5052; coolants; critical heat flux point; droplet formation; electronic devices; heat fluxes; high-speed video motion analysis; optimum spray cooling system; spray-cooling database; subcoolings; thermal management; two-phase spray cooling; water; Area measurement; Coolants; Electronic equipment testing; Electronics cooling; Fluid flow measurement; Temperature; Thermal management; Thermal management of electronics; Thermal spraying; Volume measurement; boiling; critical heat flux; electronics cooling; spray cooling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544280
  • Filename
    4544280