DocumentCode
1885540
Title
Electron trapping in buried oxides formed by oxygen implantation
Author
Hurley, P.K. ; McDaid, L.J. ; Hall, S. ; Eccleston, W. ; Alderman, J.C.
Author_Institution
Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
fYear
1991
fDate
1-3 Oct 1991
Firstpage
6
Lastpage
7
Abstract
Previous work has demonstrated how the capacitance/voltage characteristics of the SOI (silicon-on-insulator) structure can be used to interpret the effect of Fowler-Nordheim stressing of the buried oxide. The authors extend the previous work by reporting the effects of avalanche injection of electrons into the buried oxide. As the average electric fields in the oxide are low during avalanche injection (typically <3 MV/cm), the technique permits the characterization of intrinsic electron traps. The experiments were performed on SOI capacitor structures produced by oxygen implantation at 200 keV and an equivalent dose of 1.8×1018 O+ cm-2 . The variation of the flatband voltage in the body and the substrate for an electron injection current density of 1.5×10-6 A/cm2 is shown. Two trapping centers with capture cross-sections of 8×10-15 cm2 and 1×10-16 cm2, with densities of 5×1011 and 1×1012, respectively, are revealed
Keywords
electron traps; elemental semiconductors; interface electron states; ion implantation; oxygen; semiconductor-insulator boundaries; silicon; 200 keV; SOI capacitor structures; Si-SiO2; Si:O+; avalanche injection; buried oxides; electron injection current density; flatband voltage; intrinsic electron traps; ion implantation; trapping centers; Body regions; Capacitance-voltage characteristics; Current density; Electron traps; MOS capacitors; Microelectronics; Monitoring; Oxygen; Pulse measurements; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1991. Proceedings, 1991., IEEE International
Conference_Location
Vail Valley, CO
Print_ISBN
0-7803-0184-6
Type
conf
DOI
10.1109/SOI.1991.162829
Filename
162829
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