A new high temperature multilayer capacitor with acrylate dielectrics

A capacitor technology that makes use of vacuum-deposited electron-beam cross-linked acrylate materials has been developed. Polymer multilayer monolithic capacitors are produced by a continuous high-speed vacuum process. The polymer dielectric is formed by flash-evaporating an acrylate monomer material onto a rotating drum and then cross-linking it by electron-beam irradiation. The resulting polymer is thermally stable at temperatures in excess of 300°C. The dielectric films are pinhole-free, with stable electrical properties. The capacitor electrodes are vapor-deposited aluminium and are thin enough to allow the capacitor to self-heal. The number of layers typically varies between 1000 and 5000 and the dielectric thickness between 0.3 and 1.0 μm. The low dielectric thickness results in capacitor chips with high volumetric efficiency that can be surface mounted by conventional soldering techniques. An overview of the vacuum process, chip cutting, termination, packaging, electrical characteristics, and general test methodology is given here