• DocumentCode
    1885604
  • Title

    Security-enhanced 3D communication structure for dynamic 3D-MPSoCs protection

  • Author

    Sepulveda, Johanna ; Gogniat, Guy ; Pires, Ramon ; Wang Chau ; Strum, Marius

  • Author_Institution
    Microelectron. Lab. LME, Univ. of Sao Paulo, Sao Paulo, Brazil
  • fYear
    2013
  • fDate
    2-6 Sept. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Three-dimension Multiprocessors System-on-Chip (3D-MPSoCs) hold promises to allow the development of compact and efficient devices. By means of such technology, multiple applications are supported on the same chip, which can be mapped dynamically during the execution time. This flexibility offered by the 3D technology, also represents vulnerability, turning the 3D-MPSoC security into a challenging task. 3D communication structures (3D-HoCs), which combine buses and network-on-chip can be used to efficiently overcome the present 3D-MPSoC vulnerabilities. 3D-HoCs can be used to implement different security services, monitor the data exchange and isolate dangerous IPs. In this paper, we implement Quality of Security Service (QoSS) in 3D-HoC to efficiently detect and prevent attacks by means of agile and dynamic security firewalls. Such a method takes advantage of the 3D-HoC wide system visibility and critical role in enabling system operation. We evaluate the effectiveness of our approach over several 3D-MPSoCs attack scenarios and estimate their impact on the overall performance. Results show that our architecture can perform a fast detection of a wide range of attacks and a fast configuration of the different security policies.
  • Keywords
    multiprocessing systems; network-on-chip; quality of service; telecommunication security; three-dimensional integrated circuits; 3D technology; 3D-HoC wide system visibility; QoSS; buses; data exchange; dynamic 3D-MPSoC protection; dynamic security firewalls; isolate dangerous IP; network-on-chip; quality of security service; security policy; security services; security-enhanced 3D communication structure; three-dimension multiprocessor system-on-chip; Access control; Computer architecture; Monitoring; Niobium; Quality of service; Three-dimensional displays; 3D-MPSoC; Network-on-chip; bus; performance; quality-of-service; security;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits and Systems Design (SBCCI), 2013 26th Symposium on
  • Conference_Location
    Curitiba
  • Type

    conf

  • DOI
    10.1109/SBCCI.2013.6644851
  • Filename
    6644851