In-situ cure assembly and thermal performance verification of electronic packages using chip heat

An innovative in-situ electronic package assembly process is presented using the on-chip power to cure the package thermal interface and seal materials and to verify the thermal performance of the electronic package. The in-situ curing process was thermally modeled to demonstrate that the thermal interface and seal materials would reach their required curing temperatures by controlling the chip power and heat sink air flow. Experimental validation of the in-situ cure method was conducted using thermal test vehicles. Thermal resistance characterization of the in-situ cured package in comparison to a batch oven cured package showed better thermal performance stability with increasing temperature.