• DocumentCode
    1886142
  • Title

    Experimental studies on synthetic jet cooling enhancement for portable platforms

  • Author

    Go, David B. ; Mongia, Rajiv K.

  • Author_Institution
    Sch. of Mech. Eng. & Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    528
  • Lastpage
    536
  • Abstract
    As portable platforms including laptops, handheld PCs, and similar handheld electronics become more powerful and more popular, they present unique thermal management challenges. In the past, most thermal management solutions have dealt with directly cooling the microprocessor by way of a heat spreader, heat sink, and fan. However, the microprocessor thermal solution does not cool all areas of the entire platform, and prominent thermal issues arise and must be addressed. For example, maintaining a comfortable skin temperature in portable electronics is a major issue as devices operate at higher powers and with more capabilities. Additionally, the small form factors and limited volume of portable devices make the cooling of the overall platform a significant challenge. Synthetic jets are diaphragm-induced flow devices that can be used to enhance heat transfer in locations otherwise cooled by natural convection or very low-speed forced convection. In this work, the performance of synthetic jets operating perpendicular (i.e., in cross-flow) to a low speed duct flow is investigated. The nature of the jet and bulk flow interaction is studied using particle image velocimetry (PIV) and thermal measurements are taken on a heated duct wall. Synthetic jets are shown to slow down the bulk flow by entraining mass into the flow and creating "dead zones" where the bulk flow is blocked. The heat transfer studies indicate that cooling can be increased in the main body of the synthetic jet stream by as much as 25% but that the jet creates an impediment to the bulk flow which results in other areas of localized heating.
  • Keywords
    cooling; forced convection; jets; natural convection; particle velocity analysis; pipe flow; portable computers; portable instruments; thermal management (packaging); diaphragm-induced flow device; duct flow; fan; forced convection; heat sink; heat spreader; heat transfer; natural convection; particle image velocimetry; portable electronics; portable platforms; synthetic jet cooling enhancement; synthetic jets; thermal management; thermal measurements; Ducts; Electronics cooling; Energy management; Heat sinks; Heat transfer; Microprocessors; Personal communication networks; Portable computers; Thermal management; Thermal management of electronics; PIV; cross-flow; heat transfer enhancement; synthetic jet;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544313
  • Filename
    4544313