Title :
Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistance
Author :
Ishizuka, Masaru ; Nakagawa, Shinji
Author_Institution :
Toyama Prefectural Univ., Toyama
Abstract :
This paper describes the effects of the outlet vent size and the distance between the outlet vent location and the power heater position on the flow resistance in natural-air-cooled electronic equipment casings. An experiment was carried out using a simple model casing simulated for the practical natural-air-cooled casing which is composed of 4 side walls, a top plate and bottom plate which has an inlet opening. A power heater served as a power dissipation unit was placed at its open bottom. An outlet opening was set on one of the side walls. The opening area, the height of the outlet and the heater location were varied. The experimental results were analyzed using the flow resistance coefficient K which was related to the distance between the outlet vent and the power heater position and the heat removal from the outlet vent, and K values were plotted against a pair of Reynolds numbers Re and the outlet vent porosity b which is defined as the ratio of outlet vent open area to the top surface area of the casing.
Keywords :
cooling; natural convection; thermal management (packaging); Reynolds numbers; electronic equipment casings; flow resistance coefficient; heater location; natural air cooling design; natural-air-cooled electronic equipment casings; outlet vent location; power dissipation unit; power heater; power heater position; vent size; Computational fluid dynamics; Electronic equipment; Electronic packaging thermal management; Electronics cooling; Heat transfer; Immune system; Resistance heating; Surface resistance; Vents; Wire; Cooling design; Electronic equipment; Flow resistance; Natural convection; outlet vent;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2008.4544316