Title :
Hybrid solid state/fluidic cooling for hotspot removal
Author :
Sahu, Vivek ; Joshi, Yogendra K. ; Fedorov, Andrei G.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
In this paper we describe a novel cooling scheme utilizing a combination of fluidic (single-phase convection and phase change) and solid-state (superlattice cooler) techniques to simultaneously remove high background heat fluxes (~100 W/cm2) over the entire chip and dissipate ultra high heat fluxes (~0.5-1 kW/cm2) from multiple localized hotspots. This paper focuses on the conceptual design to assess the feasibility of the proposed cooling scheme.
Keywords :
convection; cooling; thermal management (packaging); fluidic cooling; heat fluxes; hotspot removal; hybrid solid state cooling; multiple localized hotspots; phase change; single-phase convection; solid-state superlattice cooler; Cooling; Heat sinks; Microchannel; Microstructure; Solid state circuits; Superlattices; Temperature; Thermal conductivity; Thermal management; Thermal resistance; Hotspot; Microchannel heat sink; Phase change; Singlephase convection; Solid-State;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2008.4544327
