Strain-rate-dependant mechanical properties for Sn-3.8Ag-0.7Cu and SAC-X solder alloy

Author

Xu, Luhua ; Tan, Kok Ee ; Pang, John H L

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore

fYear

2008

fDate

28-31 May 2008

Firstpage

632

Lastpage

637

Abstract

The mechanical properties of electronic solder materials are highly dependent on test temperature and strain rate. In this paper strain rate dependent elastic modulus and yield strength of Sn-3.8Ag-0.7Cu and Sn-Ag-Cu-X (SAC-X) where, X is a small addition of a fourth element. Nano-indentation tests were conducted from slow to intermediate strain rates, (10^-3 ~10¹) by using the continuous stiffness measurement (CSM) technique. The strain-rate-dependent yield stress is curve fitted to a power law relationship with strain rate. For all the tests conducted, the higher the strain rate the higher the elastic modulus and yield stress of the solder; the higher the temperature the lower the elastic modulus and yield stress.

Keywords

copper alloys; elastic moduli; indentation; silver alloys; soldering; solders; tin alloys; yield stress; Sn-Ag-Cu; continuous stiffness measurement technique; dependent elastic modulus; elastic modulus; electronic solder materials; intermediate strain rates; nanoindentation tests; solder alloy; strain-rate-dependant mechanical properties; strain-rate-dependent yield stress; Capacitive sensors; Creep; Mechanical factors; Soldering; Strain measurement; Stress measurement; Temperature; Tensile strain; Tensile stress; Testing; continuous stiffness measurement; drop impact; nano-indentation; solder; strain-rate;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Print_ISBN

978-1-4244-1700-1

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2008.4544328

Filename

4544328