• DocumentCode
    1887260
  • Title

    Edge element modeling of 3D interconnection structures

  • Author

    Jilin Tan ; Guangwen Pan ; Gilbert, B.K.

  • Author_Institution
    Compact Software Inc., Arizona State Univ., Tempe, AZ, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    7-12 June 1998
  • Firstpage
    1077
  • Abstract
    In this paper, we apply the local potential concept to construct a functional for the finite element method (FEM) with 3D structures. The corresponding boundary conditions at the planes of incidence and transmittance for hybrid modes are derived. These conditions take into account both the transverse and longitudinal field components of the propagating signals. Employing these boundary conditions, in conjunction with the absorbing boundary conditions (ABC) and/or the boundary conditions of the first and third kind, a 3D asymmetrical functional is implemented as a hybrid vector edge element method. Numerical examples are presented for air bridges and lossy transmission lines, connected by a through-hole via. The equivalent frequency dependent circuit parameters are then extracted from the field solutions. Laboratory measurements and data comparison with previous published results strongly support the newly developed theoretical work.
  • Keywords
    equivalent circuits; finite element analysis; integrated circuit interconnections; integrated circuit modelling; 3D asymmetrical functional; 3D interconnection structures; IC interconnections; absorbing boundary conditions; air bridges; edge element modeling; equivalent frequency dependent circuit parameters; hybrid modes; local potential concept; longitudinal field components; lossy transmission lines; propagating signals; through-hole via; transverse field components; Boundary conditions; Bridge circuits; Data mining; Distributed parameter circuits; Finite element methods; Frequency dependence; Integrated circuit interconnections; Laboratories; Propagation losses; Transmission line theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1998 IEEE MTT-S International
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-4471-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.1998.705180
  • Filename
    705180