Title :
Stress analysis of a micro-machined inertial sensor at dynamic load
Author :
Hauck, Torsten ; Schmadlak, Ilko ; Mehner, Jan
Author_Institution :
Freescale Semicond., Austin, TX
Abstract :
This paper presents modeling and simulation techniques for the the dynamic behavior of inertial sensors. A detailed model of a sensor is generated at the continuous field level, which considers multiple physical domains, such as structural dynamics, fluidics and electrostatics. To reduce the large order of the problem, a compact model is derived by decomposition of the deformation field into basic mode shape functions. The dynamic behavior of the sensor structure is described by superposition of its dominant vibration mode shapes. The resulting reduced-order model (ROM) still considers all physical domains and is even able to capture nonlinear phenomena, such as stress stiffening of constraint structures or frequency and deflection dependent damping and stiffening caused by the squeezed gas in the sensor cell. The ROM algorithms were extended to account for MEMS package-transducer interactions. Process induced and thermally induced residual stresses and resulting deformation of the transducer elements are considered.
Keywords :
micromechanical devices; sensors; stress analysis; MEMS; micromachined inertial sensor; package-transducer interactions; reduced-order model; stress analysis; stress stiffening; Deformable models; Electrostatics; Fluid dynamics; Fluidics; Read only memory; Reduced order systems; Residual stresses; Sensor phenomena and characterization; Shape; Thermal stresses;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2008.4544369