Title :
TPM activities at Motorola SCG America
Author_Institution :
Motorola Inc., Phoenix, AZ, USA
Abstract :
Cost control, equipment lifespans, and productivity are concerns for all semiconductor manufacturers. Equipment purchase prices are aggressively spiraling upward. The pressure to reduce wafer manufacturing costs is relentless. Total Productive Maintenance is one form of relief that allows a manufacturer to wring the most return from the equipment set. Motorola is attempting to use this methodology to some degree. The Phoenix factory RFI has a three year history with the process. The current initiative is to implement TPM at the Group level at Motorola SCG
Keywords :
economics; integrated circuit manufacture; maintenance engineering; Group level; Motorola SCG; TPM activities; cost control; equipment lifespans; productivity; semiconductor manufacture; total productive maintenance; wafer manufacturing costs; Accidents; Availability; Continuous improvement; Costs; Electric breakdown; History; Manufacturing processes; Production facilities; Radiofrequency interference; Semiconductor device manufacture;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664493