• DocumentCode
    1888088
  • Title

    Impact of rack-level compaction on the data center cooling ensemble

  • Author

    Shah, Amip ; Patel, Chandrakant ; Bash, Cullen ; Sharma, Ratnesh ; Shih, Rocky

  • Author_Institution
    Hewlett Packard Co., Palo Alto, CA
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    1175
  • Lastpage
    1182
  • Abstract
    The growing energy consumption of computer data centers has recently received increased economic and environmental scrutiny. A significant portion of typical data center energy consumption can be apportioned to the cooling infrastructure. This paper shows the impact of heat load within the data center on the efficiency of the data center cooling ensemble, as measured in terms of a ´grand´ Coefficient of Performance of the ensemble (COPG). The paper begins by developing an expedient, semi-empirical model of the cooling infrastructure in an actual data center in Bangalore, India. These predictions are compared to experimental measurements at various levels of the ensemble, with good agreement between predicted and measured values. Having validated the model, the impact of replacing low-density racks with high-density blades into the data center is explored. For the test case considered in this paper, it is found that consolidation leads to greater efficiency of the infrastructure components, causing COPG to increase by about 15%. The paper concludes by quantifying the impact of this consolidation on the total cost-of-ownership (TCO). For the test case, the consolidation results in improved utilization of the infrastructure, thus effectively reducing the burdened TCO (per Watt of computation) by up to 30%.
  • Keywords
    DP industry; compaction; computer centres; cooling; electronics industry; electronics packaging; computer data centers; cooling infrastructure; data center cooling ensemble; energy consumption; high-density blades; low-density racks; rack-level compaction; total cost-of-ownership; Compaction; Computer networks; Cooling; Costs; Data flow computing; Energy consumption; Heat transfer; Refrigeration; Thermodynamics; Water heating; blade servers; consolidation; data center; electronics cooling; energy efficiency; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544394
  • Filename
    4544394