• DocumentCode
    1888161
  • Title

    Data center TCO benefits of reduced system airflow

  • Author

    Malone, Christopher G. ; Vinson, Wade ; Bash, Cullen E.

  • Author_Institution
    Google Inc., Mountain View, CA
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    1199
  • Lastpage
    1202
  • Abstract
    New blade chassis designs, with banks of aggregate fans and system-level thermal architectures which precisely manage airflow, have enabled a new level of energy savings for enterprise customers that extends beyond the system and offers an opportunity for new system thermal design principles. By reducing system airflow rate to an absolute minimum, system fan power is minimized. More significantly, lowering airflow rates reduces data center cooling infrastructure power requirements. This work outlines the opportunities enabled by extending this concept to all IT equipment design and coupling the concept with data centers control mechanisms, tying server inlet temperatures to air conditioning flow rates and set point temperatures, for breakthrough infrastructure cost structures.
  • Keywords
    air conditioning; data warehouses; energy conservation; IT equipment design; TCO benefits; air conditioning flow rates; airflow management; blade chassis designs; data center cooling infrastructure power requirements; data centers control; energy savings; reduced system airflow; server inlet temperatures; set point temperatures; system airflow rate reduction; system-level thermal architectures; Aggregates; Air conditioning; Blades; Cooling; Costs; Energy management; Fans; Power system management; Temperature control; Thermal management; IT equipment energy efficiency; airflow management; data center thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544397
  • Filename
    4544397