• DocumentCode
    1888162
  • Title

    Investigations of growth conditions for InP suited for micro opto electro mechanical systems for data communication

  • Author

    Strassner, M. ; Chitica, N. ; Tarraf, A.

  • Author_Institution
    Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Kista, Sweden
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    351
  • Lastpage
    354
  • Abstract
    InP based micro-mechanical systems rely on a well-controlled stress within the structural InP layers. During the growth of InP, residual arsenic atoms from the previous InGaAs growth are incorporated into the crystal causing a compressive stress gradient. We present a method to reduce the gradient strain by changing the growth sequence of the InGaAs/InP heterostructure. The InGaAs layer is covered with a thin InP cap enabling an extended growth interrupt prior the growth of the structural InP layer. The presented growth procedure enables the growth of low gradient stress InP suited for the fabrication of micro-mechanical devices. To demonstrate the feasibility of the proposed growth sequence on a device fabrication level, a tunable resonant cavity light emitting diode has been grown, micromachined, and characterised.
  • Keywords
    III-V semiconductors; indium compounds; light emitting diodes; micro-optics; semiconductor growth; InGaAs-InP; InGaAs/InP hetero-structure; InP cap; MOEMS; compressive stress gradient; data communication; gradient strain reduction; growth conditions; growth sequence; light emitting diode; low gradient stress InP; micro opto electro mechanical systems; micro-mechanical device fabrication; structural InP layer; tunable resonant cavity LED; Atomic layer deposition; Capacitive sensors; Compressive stress; Data communication; Fabrication; Indium gallium arsenide; Indium phosphide; Mechanical systems; Residual stresses; Resonance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-7320-0
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2002.1014418
  • Filename
    1014418