DocumentCode :
1888267
Title :
Reliability and packaging issues in optoelectronics
Author :
Fukuda, Mitsuo
Author_Institution :
Photonic Bus. Group, NTT Electron. Corp., Tokyo, Japan
fYear :
2002
fDate :
2002
Firstpage :
359
Lastpage :
362
Abstract :
Reliability and packaging issues are discussed for InGaAsP/InP laser diodes and photodiodes used in current optical fiber transmission systems such as DWDM, SONET/SDH, and data communications.
Keywords :
III-V semiconductors; gallium arsenide; gallium compounds; indium compounds; optical communication equipment; photodiodes; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; DWDM systems; InGaAsP-InP; InGaAsP/InP laser diodes; InGaAsP/InP photodiodes; SONET/SDH; optical fiber transmission systems; optoelectronic components; packaging issues; reliability issues; Diode lasers; Frequency; Optical modulation; Optical receivers; Optical transmitters; Packaging; Photodiodes; Strontium; Transceivers; Transponders;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
ISSN :
1092-8669
Print_ISBN :
0-7803-7320-0
Type :
conf
DOI :
10.1109/ICIPRM.2002.1014422
Filename :
1014422
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1888267
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