Title :
Slurry delivery system design for tungsten chemical mechanical planarization manufacturing site
Author :
Mizuno, Hiroshi ; Miyamoto, Yoshinori ; Shikami, Satoshi ; Bare, J.
Author_Institution :
LSI Logic Japan, Tsukuba, Japan
Abstract :
A bulk slurry delivery system is necessary at manufacturing sites using Chemical Mechanical Planarization (CMP). Slurry settling is an important issue in the slurry handling operation. Slurry settling characteristics and the effective connection of the polishers to the slurry delivery loop were studied. This paper presents the results of the study and of the polishing performance by polishers connected in an effective slurry delivery system
Keywords :
flow control; integrated circuit manufacture; integrated circuit metallisation; materials handling; polishing; pumps; separation; valves; W; effective connection; flow rate control; full scale delivery loop; manufacturing site; mass production; multilevel metallization; parallel connection; polishers; pump; separation; series connection; slurry delivery loop; slurry delivery system design; slurry handling; slurry settling characteristics; throttle device; tungsten chemical mechanical planarization; variable valve; Abrasives; Large scale integration; Logic; Manufacturing processes; Oxidation; Planarization; Semiconductor device manufacture; Slurries; Solids; Tungsten;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664496
