• DocumentCode
    1888578
  • Title

    Analysis and design of circular line-scan imaging for 3D scene visualization and reconstruction

  • Author

    Wei, Shou-Kang ; Huang, Fay ; Klette, Reinhard

  • Author_Institution
    Dept. of Info. & Comput. Sci., Keio Univ., Yokohama, Japan
  • Volume
    1
  • fYear
    2003
  • fDate
    16-20 July 2003
  • Firstpage
    447
  • Abstract
    This paper addresses recent developments of circular line-scan imaging system for applications of 3D scene visualization and/or reconstruction. Such an imaging system is characterized by rotating linear sensors capturing one image column at a time respectively. This allows for accurate mappings onto a cylindrical image surface and very high image resolutions paid by motion distortions in dynamic scenes. These images can be used, for example, for stereo visualization and 3D reconstruction in the VR applications where extremely high image resolution is of benefit (for static scenes). The paper elaborates the basic geometry, the geometric analysis, and the design and control of imaging parameters to ensure high-quality 3D data acquisition.
  • Keywords
    data acquisition; geometry; image coding; image reconstruction; image resolution; image sampling; image sensors; virtual reality; 3D scene reconstruction; 3D scene visualization; basic imaging geometry; circular line-scan imaging; cylindrical image surface; dynamic scenes; geometric analysis; high quality 3D data acquisition; image column; imaging parameters control; mappings; motion distortions; parameter design; rotating linear sensors; static scenes; stereo visualization; very high image resolutions; virtual reality applications; High-resolution imaging; Image analysis; Image reconstruction; Image resolution; Image sensors; Layout; Sensor phenomena and characterization; Sensor systems; Surface reconstruction; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Intelligence in Robotics and Automation, 2003. Proceedings. 2003 IEEE International Symposium on
  • Print_ISBN
    0-7803-7866-0
  • Type

    conf

  • DOI
    10.1109/CIRA.2003.1222131
  • Filename
    1222131