Title :
Gated p-Si field emitter arrays for sensor applications
Author :
Prommesberger, C. ; Langer, C. ; Lawrowski, R. ; Dams, F. ; Schreiner, R.
Author_Institution :
Fac. of Gen. Sci. & Microsyst. Technol., OTH Regensburg, Regensburg, Germany
Abstract :
We report on gated p-type Si-tip array cathodes for implementation into field emission electron sources for sensor applications. Arrays of 16 and 100 tips with tip heights of 3 μm and tip radii below 30 nm with integrated gate electrodes concentrically positioned 2 μm below the tip apexes were fabricated using an improved process, which leads to an enhanced isolation layer quality with sufficient breakdown field strengths and low leakage currents. Integral measurements with a fixed grid potential of 400 V showed emission currents up to 35 μA for 100 tips at a cathode voltage of 150 V and an almost negligible parasitic gate current. The array with 16 p-type Si-tips showed a significant stabilization of the emission current in the range of 0.3 - 0.4 μA, for cathode voltages between 90 V and 150 V. The current fluctuation in this saturation regime was measured for 10 minutes and a value of less than ± 1% was observed. No degradation of the cathode was found after 6 hours of operation at a constant cathode voltage of 100 V and a constant grid voltage of 400 V.
Keywords :
elemental semiconductors; field emitter arrays; isolation technology; leakage currents; silicon; Si; current 0.3 muA to 0.4 muA; current 35 muA; field emission electron sources; gated p-Si field emitter arrays; gated p-type Si-tip array cathodes; integrated gate electrodes; isolation layer; low leakage currents; sensor applications; size 3 mum; voltage 100 V; voltage 150 V; voltage 400 V; voltage 90 V; Cathodes; Current measurement; Iron; Logic gates; Semiconductor device measurement; Silicon; current stabilization; field emission; integrated gate-electrode; semiconductor; silicon tip array;
Conference_Titel :
Vacuum Nanoelectronics Conference (IVNC), 2015 28th International
Conference_Location :
Guangzhou
Print_ISBN :
978-1-4673-9356-0
DOI :
10.1109/IVNC.2015.7225567