Predictions of solder joint fatigue life

Author

Solomon, H.D. ; Brzozowski, V. ; Thompson, D.G.

Author_Institution

GE Corporate Res. & Dev., Schenectady, NY, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

351

Abstract

Procedures used to predict solder-joint life from calculations of the joint strains and low-cycle fatigue data are described. The fatigue lives of chip-carrier/printed-wiring-board joints are predicted and compared to measured values. This prediction utilizes a finite-element analysis of the string distributions in a typical joint acted upon by an imposed displacement. These strains are then used to determine the fatigue life through low-cycle fatigue data. The correlation with joint behavior requires a size-effect correction to the low-cycle fatigue lives. This correction is required because typical joint dimensions are smaller than the dimensions of the specimen utilized in the fatigue tests, and the fatigue life depends on the joint size

Keywords

fatigue testing; finite element analysis; reliability; soldering; surface mount technology; chip carrier PCB joints; chip-carrier/printed-wiring-board joints; fatigue lives; finite-element analysis; imposed displacement; joint size; joint strains; low-cycle fatigue data; size-effect correction; solder joint fatigue life prediction; string distributions; Capacitive sensors; Fatigue; Finite element methods; Isothermal processes; Lead; Life testing; Research and development; Soldering; Temperature; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122214

Filename

122214