Title :
0.1 μm InP HEMT devices and MMICs for cryogenic low noise amplifiers from X-band to W-band
Author :
Grundbacher, R. ; Lai, R. ; Barsky, M. ; Tsai, R. ; Gaier, T. ; Weinreb, S. ; Dawson, D. ; Bautista, J.J. ; Davis, J.F. ; Erickson, N. ; Block, T. ; Oki, A.
Author_Institution :
Electron. & Technol. Div., TRW Inc., Redondo Beach, CA, USA
Abstract :
We present the TRW 0.1 μm InP HEMT MMIC production technology that has been developed and used for state-of-the-art cryogenic LNA applications. The 0.1 μm InP HEMT devices typically show cutoff frequency above 200 GHz and transconductance above 1000 mS/mm. Aspects of device design and fabrication are presented which impact important parameters including the InP HEMT device gain, gate leakage current, and parasitic capacitance. One example of state-of-the-art cryogenic MMIC performance is a W-band cryogenic MMIC LNA operated at 20 degrees Kelvin that shows above 23 dB gain and a noise temperature of 30 to 40 K (0.45 to 0.6 dB noise figure) over the band of 80-105 GHz.
Keywords :
HEMT integrated circuits; III-V semiconductors; MMIC amplifiers; cryogenic electronics; high electron mobility transistors; indium compounds; integrated circuit noise; 0.1 micron; 0.45 to 0.6 dB; 20 K; 200 GHz; 23 dB; 80 to 105 GHz; InP; InP HEMT; InP HEMT MMIC; W-band; X-band; cryogenic low noise amplifier; cutoff frequency; gain; gate leakage current; noise figure; noise temperature; parasitic capacitance; transconductance; Cryogenics; Cutoff frequency; Fabrication; HEMTs; Indium phosphide; Low-noise amplifiers; MMICs; Noise figure; Production; Transconductance;
Conference_Titel :
Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
Print_ISBN :
0-7803-7320-0
DOI :
10.1109/ICIPRM.2002.1014466