Taiwan foundry for System-In-Package (SIP)

Author

Lin, Albert W.

Author_Institution

APack Technol. Inc., Hsinchu, Taiwan

fYear

2000

fDate

9-9 June 2000

Firstpage

197

Lastpage

204

Abstract

System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory, The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. The high quality of the APack service is built upon SIP technology licensed from Bell Labs of Lucent Technologies, and the experience of cost competitive wafer fabrication of foundries in Taiwan.

Keywords

application specific integrated circuits; flip-chip devices; integrated circuit design; integrated circuit packaging; reflow soldering; APack Technologies; I/O redistribution; SIP technology; Taiwan; advanced packaging solutions; cost competitive wafer fabrication; flip chip assembly; foundries; high density thin film interconnect substrate; solder bumping; system-in-package; Assembly; CMOS technology; Chip scale packaging; Components, packaging, and manufacturing technology; Costs; Flip chip; Foundries; Logic testing; System-on-a-chip; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 2000. Proceedings of the ASP-DAC 2000. Asia and South Pacific

Conference_Location

Yokohama, Japan

Print_ISBN

0-7803-5973-9

Type

conf

DOI

10.1109/ASPDAC.2000.835096

Filename

835096