• DocumentCode
    1889934
  • Title

    Improved accuracy thermal nanostructure

  • Author

    Popa, Cosmin

  • Author_Institution
    Fac. of Electron., Telecommun. & Inf. Technol., Univ. Politeh. of Bucharest, Bucharest, Romania
  • fYear
    2011
  • fDate
    27-29 April 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A new high precision superior-order curvature-corrected integrated nanostructure will be presented. In order to improve the temperature behavior of the circuit, a double differential structure will be used, implementing the linear and the superior-order curvature corrections. An original CTAT (Complementary To Absolute Temperature) voltage generator will be proposed, using exclusively MOS transistors biased in weak inversion for a low power operation of the integrated nanostructure, having two great advantages: an important reducing of the circuit silicon area and an improved accuracy (matched resistors being replaced by matched MOS active devices). The superior-order curvature-correction will be implemented by taking the difference between two gate-source voltages of subthreshold-operated MOS transistors, biased at drain currents having different temperature dependencies: PTAT (Proportional To Absolute Temperature) and PTAT2. The SPICE simulations confirm the theoretical estimated results, showing a temperature coefficient under 11ppm / K for an extended input range 223K <;T <; 423K and for a supply voltage of 1.8V and a current consumption of about 1μA.
  • Keywords
    MOS integrated circuits; SPICE; VLSI; curvature measurement; CTAT voltage generator; MOS transistors; accuracy thermal nanostructure; double differential structure; superior-order curvature-corrected integrated nanostructure; temperature behavior; Generators; Logic gates; MOSFETs; Nanoscale devices; SPICE; Temperature dependence; Temperature distribution; Temperature behavior; integrated nanostructures; superior-order curvature-correction technique;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    EUROCON - International Conference on Computer as a Tool (EUROCON), 2011 IEEE
  • Conference_Location
    Lisbon
  • Print_ISBN
    978-1-4244-7486-8
  • Type

    conf

  • DOI
    10.1109/EUROCON.2011.5929208
  • Filename
    5929208