Engineering change (EC) technology for thin film metallurgy on polyimide films

Author

Ray, S.K. ; Seshan, K. ; Interrante, M.

Author_Institution

IBM, East Fishkill, NY, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

395

Abstract

Engineering change in multichip modules such as the IBM Thermal Conduction Module (TCM) requires making new nets on the top surface of the module. This is done either to repair opens or shorts in the internal nets or to correct design errors. Since the trend in multichip packaging in the high end is towards thin-film wiring with polyimide as the dielectric, wire-bond and laser delete processes compatible with thin-film metallurgy on polyimide films are required to carry out engineering change. The authors describe the results of a technology-development effort to optimize these processes on a metal/polyimide thin-film structure

Keywords

dielectric thin films; hybrid integrated circuits; laser beam applications; lead bonding; organic insulating materials; polymer films; thin film circuits; IBM; MCM; MLC; TCM; Thermal Conduction Module; engineering change technology; laser delete processes; metal/polyimide thin-film structure; multichip modules; multichip packaging; technology-development effort; thin film metallurgy on polyimide films; thin-film wiring; wire bond process; Dielectric thin films; Error correction; Laser transitions; Multichip modules; Packaging; Polyimides; Thermal conductivity; Thermal engineering; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122220

Filename

122220