Title :
Engineering change (EC) technology for thin film metallurgy on polyimide films
Author :
Ray, S.K. ; Seshan, K. ; Interrante, M.
Author_Institution :
IBM, East Fishkill, NY, USA
Abstract :
Engineering change in multichip modules such as the IBM Thermal Conduction Module (TCM) requires making new nets on the top surface of the module. This is done either to repair opens or shorts in the internal nets or to correct design errors. Since the trend in multichip packaging in the high end is towards thin-film wiring with polyimide as the dielectric, wire-bond and laser delete processes compatible with thin-film metallurgy on polyimide films are required to carry out engineering change. The authors describe the results of a technology-development effort to optimize these processes on a metal/polyimide thin-film structure
Keywords :
dielectric thin films; hybrid integrated circuits; laser beam applications; lead bonding; organic insulating materials; polymer films; thin film circuits; IBM; MCM; MLC; TCM; Thermal Conduction Module; engineering change technology; laser delete processes; metal/polyimide thin-film structure; multichip modules; multichip packaging; technology-development effort; thin film metallurgy on polyimide films; thin-film wiring; wire bond process; Dielectric thin films; Error correction; Laser transitions; Multichip modules; Packaging; Polyimides; Thermal conductivity; Thermal engineering; Transistors; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122220
