DocumentCode
1890197
Title
Subwavelength lithography (PSM, OPC)
Author
Terasawa, Tsuneo
Author_Institution
Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
fYear
2000
fDate
9-9 June 2000
Firstpage
295
Lastpage
300
Abstract
Fabrication of fine features of smaller than 0.15 /spl mu/m is vital for future ultra-large scale integrated (ULSI) devices. An area of particular concern is whether and how optical lithography can delineate such feature sizes, i.e., smaller than the exposure wavelength. Resolution enhancement techniques for achieving subwavelength optical lithography are presented. Various types of phase shift mask (PSM) techniques and their imaging characteristics are discussed and compared to conventional binary mask technique. To apply these masks effectively to practical patterns, optical proximity effect correction (OPC) technique and a phase shifter pattern design tool must be established. These techniques offer the capability to improve resolution to exceed the wavelength limitation and to increase depth of focus.
Keywords
ULSI; phase shifting masks; photolithography; proximity effect (lithography); 0.15 micron; ULSI; depth of focus; exposure wavelength; feature sizes; optical lithography; phase shift mask; phase shifter pattern design tool; proximity effect correction; resolution enhancement techniques; subwavelength lithography; Electron optics; Focusing; Lenses; Lithography; Optical design; Optical design techniques; Optical device fabrication; Optical devices; Optical filters; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2000. Proceedings of the ASP-DAC 2000. Asia and South Pacific
Conference_Location
Yokohama, Japan
Print_ISBN
0-7803-5973-9
Type
conf
DOI
10.1109/ASPDAC.2000.835113
Filename
835113
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