• DocumentCode
    1890197
  • Title

    Subwavelength lithography (PSM, OPC)

  • Author

    Terasawa, Tsuneo

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
  • fYear
    2000
  • fDate
    9-9 June 2000
  • Firstpage
    295
  • Lastpage
    300
  • Abstract
    Fabrication of fine features of smaller than 0.15 /spl mu/m is vital for future ultra-large scale integrated (ULSI) devices. An area of particular concern is whether and how optical lithography can delineate such feature sizes, i.e., smaller than the exposure wavelength. Resolution enhancement techniques for achieving subwavelength optical lithography are presented. Various types of phase shift mask (PSM) techniques and their imaging characteristics are discussed and compared to conventional binary mask technique. To apply these masks effectively to practical patterns, optical proximity effect correction (OPC) technique and a phase shifter pattern design tool must be established. These techniques offer the capability to improve resolution to exceed the wavelength limitation and to increase depth of focus.
  • Keywords
    ULSI; phase shifting masks; photolithography; proximity effect (lithography); 0.15 micron; ULSI; depth of focus; exposure wavelength; feature sizes; optical lithography; phase shift mask; phase shifter pattern design tool; proximity effect correction; resolution enhancement techniques; subwavelength lithography; Electron optics; Focusing; Lenses; Lithography; Optical design; Optical design techniques; Optical device fabrication; Optical devices; Optical filters; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2000. Proceedings of the ASP-DAC 2000. Asia and South Pacific
  • Conference_Location
    Yokohama, Japan
  • Print_ISBN
    0-7803-5973-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2000.835113
  • Filename
    835113