Title :
Production of MCP chip carriers
Author :
Williams, Mary Ellen
Author_Institution :
IBM Corp., Endicott, NY, USA
Abstract :
Full-scale production of metallized ceramic polyimide (MCP) chip carriers has been practiced for several years by IBM. The MCP package includes two layers of circuitry that are electrically isolated except for vias through a polyimide dielectric layer. This circuitry/polyimide/circuitry sandwich is formed on top of an alumina ceramic base by several passes of photolithographic processing. Connection to the card is provided by pins that go through the ceramic package and into the card, and connection to the chip is provided by controlled collapse chip connection (C4) solder joints. The product construction, performance advantages, and future modifications are described
Keywords :
packaging; soldering; Al2O3 cewramic base; C4 solder joints; IBM; PGA chip carriers; circuitry/polyimide/circuitry sandwich; controlled collapse chip connection; mass production; metallized ceramic polyimide chip carriers; modifications; performance advantages; photolithographic processing; polyimide dielectric layer; product construction; two layers of circuitry; Ceramics; Chromium; Circuits; Copper; Pins; Polyimides; Production; Resists; Substrates; Wet etching;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122222
