• DocumentCode
    1891102
  • Title

    Design for qualification

  • Author

    Pecht, Michael G.

  • Author_Institution
    CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
  • fYear
    1993
  • fDate
    26-28 Jan 1993
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A design methodology based on the concept of designing electronic equipment to ensure rigorous qualification is presented. The design-for-qualification philosophy recognizes that life-critical electronic equipment must be designed in a manner that allows rigorous analysis in order to meet reliability goals. Several projects have already demonstrated that formal physics-of-failure evaluation is useful and cost-effective for uncovering faults early in the design process. For example, in a study of a printed wiring board assembly, acceptable aspect ratios for plated-through-holes subject to infrared reflow soldering were determined using formal physics-of-failure methods. The experience gained was used to qualify SMT (surface mount technology) printed circuit assemblies for a NASA satellite program
  • Keywords
    design engineering; failure analysis; printed circuit design; reliability; soldering; surface mount technology; SMT; design-for-qualification; electronic equipment; infrared reflow soldering; physics-of-failure evaluation; printed wiring board assembly; reliability goals; rigorous analysis; surface mount technology; Assembly; Circuit faults; Design methodology; Electronic equipment; Printed circuits; Process design; Qualifications; Reflow soldering; Surface-mount technology; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1993. Proceedings., Annual
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0943-X
  • Type

    conf

  • DOI
    10.1109/RAMS.1993.296885
  • Filename
    296885