• DocumentCode
    1891121
  • Title

    Allowable surface silicon thickness for fully-depleted SOI MOSFET´s

  • Author

    Lyu, Jong-Son ; Lee, Choochon

  • Author_Institution
    Semicond. Div., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • fYear
    1991
  • fDate
    1-3 Oct 1991
  • Firstpage
    56
  • Lastpage
    57
  • Abstract
    Allowable ranges for SOI (silicon-on-insulator) device parameters such as surface dopant concentration and surface silicon thickness are analyzed considering the condition that the front-gate should control inversion charges under the front-channel threshold. Two criteria for the front-gate control of the inversion charge over the back-gate are assumed in this analysis. As the SOI structure has more fixed oxide charge at the back-interface, the allowable surface silicon thickness becomes thinner compared with the normally accepted thickness for a fully-depleted SOI structure. To obtain an SOI structure with controllability of the front-gate over the back-gate and elimination of the floating substrate effect, optimal choice of the surface dopant concentration and surface silicon thickness is needed
  • Keywords
    impurity distribution; insulated gate field effect transistors; semiconductor-insulator boundaries; silicon; MOSFET; Si surface thickness; back-interface; device parameters; fixed oxide charge; floating substrate effect; front-channel threshold; front-gate control; fully-depleted SOI structure; inversion charges; surface dopant concentration; Capacitance; Controllability; Dielectric constant; Logic circuits; MOSFET circuits; Physics; Silicon; Telecommunication control; Thickness control; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1991. Proceedings, 1991., IEEE International
  • Conference_Location
    Vail Valley, CO
  • Print_ISBN
    0-7803-0184-6
  • Type

    conf

  • DOI
    10.1109/SOI.1991.162854
  • Filename
    162854