Title :
Performance of non-planar silicon diaphragms under large deflections
Author :
Zhang, Yafan ; Wise, Kensall D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
Thin non-planar silicon diaphragms are promising candidates for many high-performance microactuators, including microvalves and micropumps, since they can be batch fabricated using techniques that are compatible with the other portions of these devices. The fabrication and detailed simulation of such diaphragms, which are corrugated-bossed structures that unfold, accordionlike, to produce high boss deflections, are reported. Diaphragms 1 mm on a side, 3-μm thick, and containing five 10-μm-deep corrugations produce boss deflections of more than 30 μm at 760 mmHg, in close agreement with simulations. Effects related to corrugation profile diaphragm size and thickness, and internal stress are explored
Keywords :
diaphragms; electric actuators; elemental semiconductors; etching; internal stresses; micromechanical devices; pressure sensors; pumps; silicon; sputter etching; valves; 760 mmHg; MEMS; RIE; Si; corrugated-bossed structures; corrugation profile diaphragm size; dissolved-wafer process; elemental semiconductor; fabrication; four-mask process; high boss deflections; high-performance microactuators; internal stress; large deflections; micropumps; microvalves; nonplanar diaphragms; performance; simulation; thickness; wet etching; Boron; Dry etching; Fabrication; Glass; Micropumps; Microvalves; Optical microscopy; Silicon; Stress; Wet etching;
Conference_Titel :
Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.
Conference_Location :
Fort Lauderdale, FL
Print_ISBN :
0-7803-0957-X
DOI :
10.1109/MEMSYS.1993.296908