A new efficient method for substrate-aware device-level placement

The performance of high-frequency mixed-signal and analog designs heavily relies on the actual layout of the circuit components on device level. Substrate coupling has been recognized as one of the major physical design bottlenecks in this field. To deal with this problem in an efficient way, a new technique is proposed based on the sequence pair structure and corner stitching. Performance gain is guaranteed at the cost of O(M) run-time complexity, which is optimal. Simulations with randomly generated problem instances show that practical run-times are indeed linear in the size of the problem instance, thus enabling other design optimization algorithms to incorporate the proposed method without increasing run-time complexity.