DocumentCode
1891633
Title
An isolation technology for joined tungsten MEMS
Author
Chen, Liang-Yuh ; Santos, Edval J.P. ; MacDonald, Noel C.
Author_Institution
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
fYear
1993
fDate
7-10 Feb 1993
Firstpage
189
Lastpage
194
Abstract
An isolation technology utilizing a selective chemical vapor deposition (CVD) of tungsten to fabricate released, joined and isolated microelectromechanical structures (MEMS) is presented. The isolation scheme features released tungsten structures that are both mechanically joined and electrically isolated by silicon nitride and offers extra design freedom for micromachining. The technology is used to fabricate an isolated-tungsten, serial-parallel (SP), linear electrostatic, capacitive actuator. The actuator is composed of a series of released silicon nitride hinges. Experiments demonstrate that a controlled large lateral displacement range (e.g., greater than 10 μm) is achieved at modest voltages. Stable stepping motion is a major characteristic of the SP actuator. The fabrication and the operation of this linear actuator are reported
Keywords
chemical vapour deposition; electric actuators; electrostatic devices; masks; metallisation; micromechanical devices; sputter etching; tungsten; Si; Si wafer; Si3N4; W; capacitive actuator; controlled large lateral displacement range; electrically isolated; fabrication; isolation technology; joined MEMS; linear actuator; linear electrostatic; mechanically joined; microactuators; microgripper; micromachining; selective chemical vapor deposition; serial-parallel; stable stepping motion; three-mask process; Chemical technology; Chemical vapor deposition; Electrostatic actuators; Fasteners; Hydraulic actuators; Isolation technology; Micromachining; Micromechanical devices; Silicon; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.
Conference_Location
Fort Lauderdale, FL
Print_ISBN
0-7803-0957-X
Type
conf
DOI
10.1109/MEMSYS.1993.296924
Filename
296924
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