Efficient electro-thermal co-analysis on CPU+GPU heterogeneous architecture

Since supply voltage and temperature (V&T) directly influence IC performance and reliability, electro-thermal (ET) analysis including power/ground (P/G) analysis and thermal analysis is very important in IC design. On the observation that temperature´s influence on leakage current (ET coupling effect) and supply voltage´s influence on power consumption, this work proposes a novel iteration-based ET co-analysis method that simultaneously solves V&T and then with them to refresh power consumption for the next round of V&T solving. Different from present methods that regard the P/G analysis and thermal analysis as independent processes without interaction, the ET co-analysis method takes their interaction into the consideration, which leads to more practical results. Since both P/G analysis and thermal analysis are very time-consuming, this work further employs multi-thread and GPU parallel computing techniques to speed up the ET co-analysis based on a parallel computing system of CPU+GPU heterogeneous architecture (PCS_CGHA). Experimental results show that compared with our method, present ET analysis methods will give too pessimistic or optimistic results W/O considering ET coupling effect. And our efficient method on PCS_CGHA provides 44 times speedup over the naive analysis method with no acceleration.