Title :
YAG laser assisted etching for releasing silicon micro structure
Author :
Minami, Kazuyuki ; Wakabayashi, Yuji ; Matsubara, Takeshi ; Yoshimi, Kenichi ; Yoshida, Masayuki ; Esashi, Masayoshi
Author_Institution :
Fac. of Eng., Tohoku Univ., Sendai, Japan
Abstract :
YAG laser assisted etching techniques were developed and investigated for releasing silicon micro structures. HCl, SF6 etc., which produce volatile exhaust, were used as etching gas at atmospheric pressure. The YAG laser assisted etching was applied to fabricate an electrostatic microactuator, a resonating sensor and accelerometers. This resistless dry etching can be applied to three-dimensional structures
Keywords :
accelerometers; electric actuators; electric sensing devices; electrostatic devices; elemental semiconductors; etching; laser beam applications; micromechanical devices; silicon; HCl etchant; SF6 etchant; Si; Si microstructures; YAG laser assisted etching; YAl5O12; accelerometers; atmospheric pressure; electrostatic microactuator; elemental semiconductor; resistless dry etching; resonating sensor; three-dimensional structures; Dry etching; Gas lasers; Glass; Laser beams; Microactuators; Optical beams; Silicon; Structural beams; TV; Wafer bonding;
Conference_Titel :
Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.
Conference_Location :
Fort Lauderdale, FL
Print_ISBN :
0-7803-0957-X
DOI :
10.1109/MEMSYS.1993.296951
