• DocumentCode
    1892211
  • Title

    A DyadicCluster method used for nonlinear placement

  • Author

    Gao, Wenchao ; Zhou, Qiang ; Qian, Xu ; Cai, Yici

  • Author_Institution
    Sch. of Mech. Electron. & Inf. Eng., China Univ. of Min. & Technol., Beijing, China
  • fYear
    2012
  • fDate
    19-21 March 2012
  • Firstpage
    418
  • Lastpage
    423
  • Abstract
    The executing analytical global placers on a flat cell design might give the best placement results, but nevertheless can incur extremely long runtime, especially when the scale of netlists is increasing dramatically nowadays. And in the flatten mode experiments, the results reveal some unexpected situations like several cells with same logical connections are inseparable. Clustering offers an aviliable solution to above questions and give an attractive choice to reduce the scale and complexity of the design, at the same time improve the placement quality. In this paper, we present a new cluster technique called DyadicCluster to consider the internal and external connections between two cells and add the area constraints, so as to combine the most closely two cells, which is more quick and accurate than previous methods. DyadicCluster has been embedded into the global placement process of a nonlinear placer DCNP for large-scale designs. The DCNP runtime explicitly decreases compared to the flatten mode [1] by 40% and the quality improves by 12%. And the half-perimeter wirelength of our placer after detail placement outperforms current state-of-the-art placers Capo, FastPlace, Fengshui and mPL5-fast by 7%, 9%, 1%, and 5% respectively.
  • Keywords
    integrated circuit layout; DyadicCluster method; clustering; flat cell design; global placement process; large-scale design; nonlinear placement; nonlinear placer DCNP; Algorithm design and analysis; Benchmark testing; Clustering algorithms; Clustering methods; Complexity theory; Educational institutions; Runtime; DyadicCluster; multi-level paradigm; nonlinear placement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2012 13th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-1034-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2012.6187527
  • Filename
    6187527