Title :
Meshless modeling of massive number of vias in interconnects by full-wave analysis
Author :
Guo, Zhonghai ; Pan, George W.
Author_Institution :
Electr. Eng. Dept., Tempe, AZ, USA
Abstract :
In this paper, a full wave approach was proposed for the investigation of frequency dependent propagation characteristics of multiple through hole vias in the interior layer of multi-layered packaging environment. The current distributions on the vertical through hole vias are acquired and the crosstalk among the vias is investigated. This method can be applied to high-density and high-speed multiple layer circuit with less CPU time and memory compared to numerical methods. The results are obtained for vias in one layer and are compared against that of HFSS with excellent agreement.
Keywords :
Fourier transforms; Galerkin method; electric field integral equations; electromagnetic wave propagation; interconnections; magnetic materials; HFSS; current distributions; frequency dependent propagation characteristics; full-wave analysis; high-density multiple-layer circuit; high-speed multiple-layer circuit; meshless modeling; multilayered packaging environment; multiple through hole vias; Admittance; Analytical models; Arrays; Fourier series; Magnetic resonance imaging; Software; Transmission line matrix methods;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2010 IEEE
Conference_Location :
Toronto, ON
Print_ISBN :
978-1-4244-4967-5
DOI :
10.1109/APS.2010.5561855
