DocumentCode
1892592
Title
Bit error rate estimation in SRAM considering temperature fluctuation
Author
Kagiyama, Yuki ; Okumura, Shunsuke ; Yanagida, Koji ; Yoshimoto, Shusuke ; Nakata, Yohei ; Izumi, Shintaro ; Kawaguchi, Hiroshi ; Yoshimoto, Masahiko
Author_Institution
Kobe Univ., Kobe, Japan
fYear
2012
fDate
19-21 March 2012
Firstpage
516
Lastpage
519
Abstract
SRAM performance varies depending on the operating environment. This study specifically examines the bit error rate (BER) when considering temperature fluctuation. The SRAM performance is generally determined using a read margin because a half-select issue must be considered even in a write operation. As a metric of the SRAM´s performance, we also adopt a static noise margin (SNM) with which we evaluate three methods to estimate the BER considering temperature fluctuation. Method 1 iterates calculations for the SNM many times with Monte Carlo simulation. BER is defined as the number of cells that have no margin. Method 2 includes the assumption that SNM forms a normal distribution. Its BER is defined as a probability distribution function. Method 3 includes the assumption that SNM is determined as either square but not the smaller one of the two squares. The BER estimations are compared with a test chip result implemented in a 65-nm CMOS technology: Method 2 has 11.10% and Method 3 has 4.09% difference (unfortunately, Method 1 has no data missing because of a lack of simulations). The shift of the minimum operating voltage between the low and high temperatures is 0.04 V at a 128-Kb capacity when the temperature fluctuates from 25°C to 100°C.
Keywords
SRAM chips; error statistics; BER estimation; CMOS technology; Monte Carlo simulation; SRAM performance; bit error rate estimation; probability distribution function; static noise margin; temperature fluctuation; test chip; Bit error rate; Fluctuations; Random access memory; Temperature; Temperature dependence; Temperature measurement; Transistors; SRAM; bit error rate; static noise margin; temperature fluctuation;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2012 13th International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1948-3287
Print_ISBN
978-1-4673-1034-5
Type
conf
DOI
10.1109/ISQED.2012.6187542
Filename
6187542
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