DocumentCode :
1892781
Title :
Encapsulation processes for magnetic components and their effect on component functionality
Author :
Arris, Howard W.
fYear :
2001
fDate :
2001
Firstpage :
149
Lastpage :
153
Abstract :
Sandia National Laboratories has been encapsulating magnetic components for over 40 years. The design of magnetic component assemblies that must withstand a variety of environments and then function correctly is dependent on the appropriate use of encapsulating formulations. Specially developed material processing parameters are often critical in the encapsulation process and enable us to provide high reliability magnetic components. This paper discusses encapsulation process parameters for several of our formulations utilized for magnetic components. Process deviations that affect component functionality are also discussed
Keywords :
encapsulation; magnetic devices; transformers; Sandia National Laboratories; encapsulating formulations; encapsulation process parameters; epoxy processing; high reliability magnetic components; inductors; magnetic components; magnetic components encapsulation; material mixing; material processing parameters; polyurethane foam processing; solenoid coils; transformers; urethane processing; vacuum encapsulation; Assembly; Encapsulation; History; Insulation; Laboratories; Magnetic materials; Manufacturing processes; Materials processing; Moisture; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 2001. Proceedings
Conference_Location :
Cincinnati, OH
ISSN :
0362-2479
Print_ISBN :
0-7803-7180-1
Type :
conf
DOI :
10.1109/EEIC.2001.965603
Filename :
965603
Link To Document :
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