DocumentCode :
1892839
Title :
AMHS for 300 mm wafer
Author :
Kurosaki, Ryo ; Nagao, Naoki ; Komada, Hiromi ; Watanabe, Yoshio ; Yano, Hiroshi
Author_Institution :
Div. of Manuf. Eng., Fujitsu Labs. Ltd., Kawasaki, Japan
fYear :
1997
fDate :
6-8 Oct 1997
Abstract :
Many discussions are currently underway concerning the imminent introduction of new 300 mm generation wafer fabrication facilities. An Automated Material Handling System (AMHS) is at the center of interest and various transport methods are being studied and proposed by various manufacturers and committees. Since the weight of transport materials is estimated to increase in a 300 mm wafer fabrication facility, it will be difficult to transport such materials by human hand. Therefore, it is highly probable that an AMHS will play a significant role in a reduced operator wafer fab. In this paper, the results of a transport capability investigation with two different transport methods are examined and guidelines for selecting the best transport method are suggested
Keywords :
automatic guided vehicles; integrated circuit manufacture; materials handling; process control; 300 mm; AGV; automated material handling system; average lead time; bay-to-bay system; monorail; new generation wafer fabrication facility; reduced operator wafer fab; transport capability investigation; virtual wafer fab; Conducting materials; Fabrication; Guidelines; Manufacturing automation; Materials handling; Radio access networks; Read only memory; Semiconductor device modeling; Transportation; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
Type :
conf
DOI :
10.1109/ISSM.1997.664525
Filename :
664525
Link To Document :
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