• DocumentCode
    1892839
  • Title

    AMHS for 300 mm wafer

  • Author

    Kurosaki, Ryo ; Nagao, Naoki ; Komada, Hiromi ; Watanabe, Yoshio ; Yano, Hiroshi

  • Author_Institution
    Div. of Manuf. Eng., Fujitsu Labs. Ltd., Kawasaki, Japan
  • fYear
    1997
  • fDate
    6-8 Oct 1997
  • Abstract
    Many discussions are currently underway concerning the imminent introduction of new 300 mm generation wafer fabrication facilities. An Automated Material Handling System (AMHS) is at the center of interest and various transport methods are being studied and proposed by various manufacturers and committees. Since the weight of transport materials is estimated to increase in a 300 mm wafer fabrication facility, it will be difficult to transport such materials by human hand. Therefore, it is highly probable that an AMHS will play a significant role in a reduced operator wafer fab. In this paper, the results of a transport capability investigation with two different transport methods are examined and guidelines for selecting the best transport method are suggested
  • Keywords
    automatic guided vehicles; integrated circuit manufacture; materials handling; process control; 300 mm; AGV; automated material handling system; average lead time; bay-to-bay system; monorail; new generation wafer fabrication facility; reduced operator wafer fab; transport capability investigation; virtual wafer fab; Conducting materials; Fabrication; Guidelines; Manufacturing automation; Materials handling; Radio access networks; Read only memory; Semiconductor device modeling; Transportation; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-3752-2
  • Type

    conf

  • DOI
    10.1109/ISSM.1997.664525
  • Filename
    664525