• DocumentCode
    1893051
  • Title

    Next generation insulation for high operating stress

  • Author

    Emery, F.T. ; Smith, J.D.B.

  • Author_Institution
    Siemens Westinghouse Power Corp., Fort Payne, AL, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    209
  • Lastpage
    212
  • Abstract
    The accurate control of the combination of mica paper, appropriate resin, and accelerator are important contributors to the overall mechanical and electrical properties of the high voltage coil groundwall insulated with mica paper tapes and impregnated with a high temperature epoxy resin. This paper presents the results of the dielectric performance when using special designed mica tapes for vacuum-pressure-impregnated (VPI) groundwall insulation. The objectives are to develop a glass backed mica tape with higher dielectric properties than commercially available tapes. Custom tapes were developed; working with a number of tape manufacturers. These tapes were used to make up insulated test bars and the best performing tape was applied to full size coils. This paper reports the final results of this investigation to develop the next generation stator groundwall system
  • Keywords
    impregnated insulation; insulation testing; machine insulation; mica; paper; stators; accelerator; dielectric performance; electrical properties; glass backed mica tape; high temperature epoxy resin; high voltage coil groundwall insulation; impregnated mica paper tapes; insulated test bars; mechanical properties; mica paper; resin; stators; vacuum-pressure-impregnated groundwall insulation; Coils; Dielectrics and electrical insulation; Epoxy resins; Glass; Manufacturing; Mechanical factors; Stress; Temperature control; Testing; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 2001. Proceedings
  • Conference_Location
    Cincinnati, OH
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-7180-1
  • Type

    conf

  • DOI
    10.1109/EEIC.2001.965612
  • Filename
    965612