Title :
High-g testing of MEMS devices, and why
Author :
O´Reilly, Rob ; Tang, Huy ; Chen, Wei
Author_Institution :
Micromachined Products Div., Analog Devices, Inc., Cambridge, MA
Abstract :
The application envelope continues to expand with respect to shock survivability of components used in consumer products. The expansion of motion-based applications has also expanded the use of small MEMS devices with moving elements that need to continue normal operation during normal usage. The equipment and test methods required to determine product performance in these emerging applications have changed, some of which are described below.
Keywords :
consumer electronics; high gravity effects; mechanical testing; micromechanical devices; MEMS devices testing; consumer products; Accelerometers; Bridge circuits; Commercialization; Electric shock; Electrical resistance measurement; Manufacturing; Microelectromechanical devices; Micromechanical devices; Strain measurement; Testing;
Conference_Titel :
Sensors, 2008 IEEE
Conference_Location :
Lecce
Print_ISBN :
978-1-4244-2580-8
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2008.4716405