DocumentCode
1893305
Title
High-g testing of MEMS devices, and why
Author
O´Reilly, Rob ; Tang, Huy ; Chen, Wei
Author_Institution
Micromachined Products Div., Analog Devices, Inc., Cambridge, MA
fYear
2008
fDate
26-29 Oct. 2008
Firstpage
148
Lastpage
151
Abstract
The application envelope continues to expand with respect to shock survivability of components used in consumer products. The expansion of motion-based applications has also expanded the use of small MEMS devices with moving elements that need to continue normal operation during normal usage. The equipment and test methods required to determine product performance in these emerging applications have changed, some of which are described below.
Keywords
consumer electronics; high gravity effects; mechanical testing; micromechanical devices; MEMS devices testing; consumer products; Accelerometers; Bridge circuits; Commercialization; Electric shock; Electrical resistance measurement; Manufacturing; Microelectromechanical devices; Micromechanical devices; Strain measurement; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2008 IEEE
Conference_Location
Lecce
ISSN
1930-0395
Print_ISBN
978-1-4244-2580-8
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2008.4716405
Filename
4716405
Link To Document