• DocumentCode
    1893305
  • Title

    High-g testing of MEMS devices, and why

  • Author

    O´Reilly, Rob ; Tang, Huy ; Chen, Wei

  • Author_Institution
    Micromachined Products Div., Analog Devices, Inc., Cambridge, MA
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    148
  • Lastpage
    151
  • Abstract
    The application envelope continues to expand with respect to shock survivability of components used in consumer products. The expansion of motion-based applications has also expanded the use of small MEMS devices with moving elements that need to continue normal operation during normal usage. The equipment and test methods required to determine product performance in these emerging applications have changed, some of which are described below.
  • Keywords
    consumer electronics; high gravity effects; mechanical testing; micromechanical devices; MEMS devices testing; consumer products; Accelerometers; Bridge circuits; Commercialization; Electric shock; Electrical resistance measurement; Manufacturing; Microelectromechanical devices; Micromechanical devices; Strain measurement; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2008 IEEE
  • Conference_Location
    Lecce
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-2580-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2008.4716405
  • Filename
    4716405