• DocumentCode
    1893317
  • Title

    Impact of ultra thin oxide breakdown on circuits

  • Author

    Stathis, James H.

  • Author_Institution
    Semicond. R&D Center, T.J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2005
  • fDate
    9-11 May 2005
  • Firstpage
    123
  • Lastpage
    127
  • Abstract
    Oxide breakdown evolves in a continuous, voltage-driven manner from initial BD to higher conductance. This permits a redefinition of the oxide failure criterion at the device or circuit level. Instead of the time to first (soft) BD, the appropriate failure criterion is a critical leakage current that disrupts circuit operation. Lifetime estimates may be increased by one or more orders of magnitude over traditional first-BD projections (B. Kaczer et al., 2004). This new oxide failure criterion has two key elements: understanding and characterizing the post-breakdown defect growth and conduction, and understanding and characterizing the circuit sensitivity to leakage currents in gates that have experienced BD. Circuit simulations can be used to estimate circuit sensitivity to BD, by adding a voltage-dependent current source between the gate and one diffusion of a transistor.
  • Keywords
    integrated circuit reliability; leakage currents; semiconductor device breakdown; circuit sensitivity; circuit simulation; leakage current; oxide failure criterion; post-breakdown defect growth; transistor diffusion; ultra thin oxide breakdown; voltage-dependent current source; Breakdown voltage; CMOS logic circuits; CMOS memory circuits; Dielectric breakdown; Electric breakdown; Gate leakage; Inverters; Research and development; Stress; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology, 2005. ICICDT 2005. 2005 International Conference on
  • Print_ISBN
    0-7803-9081-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2005.1502607
  • Filename
    1502607