DocumentCode
1893317
Title
Impact of ultra thin oxide breakdown on circuits
Author
Stathis, James H.
Author_Institution
Semicond. R&D Center, T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2005
fDate
9-11 May 2005
Firstpage
123
Lastpage
127
Abstract
Oxide breakdown evolves in a continuous, voltage-driven manner from initial BD to higher conductance. This permits a redefinition of the oxide failure criterion at the device or circuit level. Instead of the time to first (soft) BD, the appropriate failure criterion is a critical leakage current that disrupts circuit operation. Lifetime estimates may be increased by one or more orders of magnitude over traditional first-BD projections (B. Kaczer et al., 2004). This new oxide failure criterion has two key elements: understanding and characterizing the post-breakdown defect growth and conduction, and understanding and characterizing the circuit sensitivity to leakage currents in gates that have experienced BD. Circuit simulations can be used to estimate circuit sensitivity to BD, by adding a voltage-dependent current source between the gate and one diffusion of a transistor.
Keywords
integrated circuit reliability; leakage currents; semiconductor device breakdown; circuit sensitivity; circuit simulation; leakage current; oxide failure criterion; post-breakdown defect growth; transistor diffusion; ultra thin oxide breakdown; voltage-dependent current source; Breakdown voltage; CMOS logic circuits; CMOS memory circuits; Dielectric breakdown; Electric breakdown; Gate leakage; Inverters; Research and development; Stress; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2005. ICICDT 2005. 2005 International Conference on
Print_ISBN
0-7803-9081-4
Type
conf
DOI
10.1109/ICICDT.2005.1502607
Filename
1502607
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