DocumentCode :
1893361
Title :
Self-heating effects in gate-all-around silicon nanowire MOSFETs: Modeling and analysis
Author :
Huang, Xin ; Zhang, Tianwei ; Wang, Rusheng ; Liu, Changze ; Liu, Yuchao ; Huang, Ru
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
fYear :
2012
fDate :
19-21 March 2012
Firstpage :
727
Lastpage :
731
Abstract :
In this paper, an electro-thermal model is proposed for the first time to accurately investigate the self-heating effects in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) for thermal-aware design optimization. The model is derived based on the equivalent thermal network method, in which the impacts of gate length dependence, nanowire diameter dependence and surface roughness on the nanowire channel thermal conductivity as well as the influence of unique GAA structure features on the heat dissipation are taken into account. The proposed model agrees well with the experimental results of SNWTs. Based on the model, the impacts of structure parameters on the current driving capabilities and heat dissipation of SNWTs are discussed. The developed electro-thermal model can be further applied to the thermal-aware design of SNWT-based circuits.
Keywords :
MOSFET; cooling; elemental semiconductors; nanowires; silicon; surface roughness; thermal conductivity; GAA structure features; SNWT-based circuits; Si; driving capabilities; electrothermal model; equivalent thermal network method; gate length dependence; gate-all-around nanowire MOSFET; heat dissipation; nanowire channel thermal conductivity; nanowire diameter dependence; self-heating effects; structure parameters; surface roughness; thermal-aware design optimization; Conductivity; Integrated circuit modeling; Logic gates; Silicon; Thermal conductivity; Thermal resistance; Gate-all-around (GAA); equivalent thermal network; self-heating effect; silicon nanowire MOSFET (SNWT);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2012 13th International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4673-1034-5
Type :
conf
DOI :
10.1109/ISQED.2012.6187572
Filename :
6187572
Link To Document :
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