• DocumentCode
    1893454
  • Title

    An approach for condition monitoring in overhead powerlines

  • Author

    Suganthi, J.

  • Author_Institution
    Aarupadai Veedu Inst. of Technol., Vinayaka Missions Univ., Paiyanoor, India
  • fYear
    2012
  • fDate
    13-15 Dec. 2012
  • Firstpage
    119
  • Lastpage
    122
  • Abstract
    It is essential to monitor the condition of Aluminum Conductor Steel Reinforced (ACSR) overhead power cables for efficient power transmission applications. Inspect the thermal ratings of power cable as a function of environmental effects, which are the affecting factors for the condition of the cable. Simulated environmental effects were introduced in the ACSR cable and the current induced temperature is observed. This paper introduces an approach for a condition monitoring of overhead power lines. The thermal model of overhead line and its function is simulated by resolving the thermal balance equations with MATLAB Simulink. In the simulated behaviour of the conductor and its surface characteristics, temperature and emissivity affects the conditions of the Powerline. The results are given that condition monitoring is a promising technique for ACSR cables to ensure the safety and quality operation.
  • Keywords
    aluminium; condition monitoring; electrical safety; environmental factors; inspection; overhead line conductors; power cables; power overhead lines; steel; ACSR overhead power cables; MATLAB Simulink; aluminum conductor steel reinforced overhead power cables; condition monitoring; emissivity affects; environmental effects; overhead power lines; power transmission applications; quality operation; safety; temperature affects; thermal balance equations; thermal model; thermal rating inspection; Condition monitoring; Conductor resistance; Emissivity; Overhead power lines; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM), 2012 International Conference on
  • Conference_Location
    Chennai
  • Print_ISBN
    978-1-4673-4633-7
  • Type

    conf

  • DOI
    10.1109/ICETEEEM.2012.6494453
  • Filename
    6494453