• DocumentCode
    1893516
  • Title

    An integrated approach to planning and scheduling at Philips Semiconductors

  • Author

    Malmstrom, Cherie

  • Author_Institution
    Philips Semicond., Albuquerque, NM, USA
  • fYear
    1997
  • fDate
    6-8 Oct 1997
  • Abstract
    One of the most difficult environments for planning and scheduling is semiconductor fabrication. Some of these challenges include: high occurrence of breakdowns and scraps, highly fluctuating demands, interplant dependency, long lead-times with large numbers of iterative and complex processes, a diverse and rapidly evolving demand mix, and multiple production sites, geographic dispersion of fabrication and assembly/test, and outsourcing. These attributes of semiconductor fabrication create a highly dynamic environment under intense economic and technological pressure, compounded by global distribution of the manufacturing process. To successfully handle dynamism and the “networked” semiconductor enterprise requires a dynamic even “real-time”, advanced planning and scheduling (APS) system that is tightly, integrated with all parts of the enterprise supply chain, from order entry, to material purchasing, through shop-floor lot sequencing
  • Keywords
    planning; production control; production engineering computing; scheduling; semiconductor device manufacture; Philips Semiconductors; breakdowns; complex processes; economic and technological pressure; enterprise supply chain; geographic dispersion; global distribution; iterative and complex processes; lead-times; material purchasing; multiple production si; outsourcing; planning; scheduling; scraps; semiconductor fabrication; shop-floor lot sequencing; technological pressure; Assembly; Electric breakdown; Environmental economics; Fabrication; Job shop scheduling; Manufacturing processes; Materials requirements planning; Outsourcing; Production; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-3752-2
  • Type

    conf

  • DOI
    10.1109/ISSM.1997.664528
  • Filename
    664528