Title :
Component performance advantages realized through thermoplastic encapsulation
Author :
Hanrahan, John ; Neal, Griff
Abstract :
Thermoplastic encapsulation of electrical and electromechanical devices continues to yield improvements in cost, performance, and environmental sealing. The use of an injection molding process enables traditional advantages of part consolidation and cost reduction via integration of mounting components, termination features, and total cycle times of 20 to 60 seconds. With the use of thermally conductive thermoplastics, advances are being realized in thermal dissipation, particulate emissions, the reduction of both structural and audible vibration, and electrical circuit encapsulation. This paper reviews these developments
Keywords :
encapsulation; plastics; seals (stoppers); thermal conductivity; thermal noise; vibration control; audible vibration; component integration; component performance improvement; cost improvements; eccentricity; electrical circuit encapsulation; electrical devices; electromechanical devices; engineering plastics; environmental sealing improvements; injection molding process; mounting components; part consolidation; particulate emissions; performance improvements; structural vibration; termination features; thermal dissipation; thermal noise reduction; thermally conductive thermoplastics; thermoplastic encapsulation; total cycle times; Acoustic noise; Costs; Encapsulation; Frequency; Injection molding; Noise reduction; Open systems; Process design; Stators; Thermal conductivity;
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 2001. Proceedings
Conference_Location :
Cincinnati, OH
Print_ISBN :
0-7803-7180-1
DOI :
10.1109/EEIC.2001.965632
